Copper anode for plating
Copper anode for plating
We offer a variety of anodes as materials for copper plating.
Copper balls are manufactured by cold forging, while plates and ovals are manufactured by rolling, resulting in consistent quality with a uniform crystal structure.
It produces little sludge and provides stable performance, which extends the life of the plating solution and makes solution management easier.
Types of copper anodes for plating (%)
・Phosphorus-containing copper
Cu content is 99.90≦
P content: 0.040-0.060≦
P content: 0.040-0.060≦
・Oxygen-free copper
Cu content is 99.96≦
Shape and dimensions (mm)
·ball
Dimensions: 27φ, 42φ, 45φ, 55φ
・Board
Dimensions: 13t x 25W x 50L, 13t x 150W x L
・Oval
Dimensions: 33t x 75t x L
*We can manufacture boards and ovals of any length upon request.
Manufacturing process
Shown fitted
Printed board
computer
